The National Science Park of Fudan University (Qingpu Innovation Center) and the Fudan University (Hongqiao) Global Alumni Sci-Tech Innovation Center were officially inaugurated on June 21, marking the strategic collaboration between Fudan University and Qingpu District in the field of technological innovation has entered a substantive phase.  

The National Science Park of Fudan University (Qingpu Innovation Center) is positioned as a high-quality innovation platform for the transformation of scientific and technological achievements, with its core mission being to promote resource integration, achievement transformation, entrepreneurial incubation, talent cultivation, and collaborative development, aiming to establish a benchmark for university-local integration.

The Fudan University (Hongqiao) Global Alumni Sci-Tech Innovation Center deeply connects with the global Fudan alumni network, referred to as the "most valuable strategic resource," and serves as a vital bridge fostering in-depth interaction among the alma mater, alumni, and regional development.

During the event, Qingpu District and Fudan University jointly released the "Concept Verification Special Policy." This policy targets top-tier scientific discoveries in cutting-edge fields such as artificial intelligence and biotechnology at Fudan University, focusing on groundbreaking technological innovations capable of driving revolutionary advancements in intelligent and health-related sectors. Qingpu has established a dedicated concept verification fund over the next five years to support the transformation and industrialization of scientific research achievements in areas like "AI + Biotechnology" at Fudan University.

The first batch of enterprises planning to settle in the Qingpu Innovation Center also signed agreements at the event, covering specialized sectors such as medical big data, diabetes health management, AI earphones, and endoscopic surgical robots.

To address the financing challenges faced by hard-tech enterprises, Bank of Shanghai signed a 1-billion-yuan (US$139.28 million) intent credit agreement with the Qingpu Innovation Center. Bank of Shanghai will offer tailored financial products such as "investment-loan linkage" and "talent loans" tailored to the characteristics of sci-tech innovation enterprises.

Additionally, the "Bank of Shanghai Cup AI Innovation and Entrepreneurship Competition" was officially launched, calling for innovative projects in the AI field globally, with substantial prizes and industrial resource support.