Shanghai Hiwin breaks ground on new industry base in Qingpu Release time:December 24,2025
Construction of ShanghaiHiwinMechatronic Technology Co Ltd's new industry basehas kicked offin the Qingpu Comprehensive Bonded Zone.
Upon completion, the base is set to become a hub for high-end equipment and intelligent manufacturing enterprises, forming a complete industrial chain encompassing "R&D – incubation – production – application."
The ShanghaiHiwinindustry base covers a total area of 34.85 mu (2.32 hectares), with a total floor area of 50,617 square meters. It includes one comprehensive building, two standardized production plants, and plans for an intelligent warehousing center and supporting R&D facilities.
Since establishing its presence in the Qingpu Industrial Park in 2016, the company has been at the forefront of key technologies in high-end manufacturing fields such as semiconductor equipment, automotive electronics, and 3C smart equipment.
"We provide customers with comprehensive solutions for precision motion control and transmission, with semiconductor core technology products being a key focus in our development plan," said General Manager Wu Jinhui.